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One of the main challenges to the continued improvement of integration
density of information processing equipment is the removal of dissipated
heat. This is caused by the increased power density resulting from
smaller transistors and faster clock speeds. Thermophysical research
helps to improve heat transfer from the transistor junctions through
the chip and interfaces, and eventually to the ambient air or the
coolant circuit. With microfabrication techniques we create interfaces
and coolers with high aspect ratio patterns. Hierarchical nested
structures use principles ubiquitous in nature to reduce the pressure
drop that occurs when paste is squeezed out of gaps, thus creating
high-performance thermal interfaces, as well as for liquid cooling
with many tens of thousands of capillaries or jets.
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