Optical transceiver modules

Overview

The coupling of the light from the VCSELs into the waveguides and from the waveguides onto the detectors is based on direct butt-coupling. The silicon optoelectronic (OE) modules populated by flip-chip bonding either with VCSELs or detectors are placed in direct contact with the waveguides without additional optical elements. The light is guided through the Si module by integrated waveguides based on holes etched through the silicon, which are then oxidized and filled with a polymer.

This integrated OE module concept requires only one alignment step in the board and is compatible with a multi-layer waveguides approach.

Principle Figure 1. Principle: Optoelectrical module consisting of a silicon carrier populated with either VCSELs or PD and electrically connected to the PCB by an electrical flex. The light is coupled into the waveguides by direct butt-coupling.

Realization Figure 2. Realization: Optoelectrical module consisting of a silicon carrier populated with either VCSELs or PD and electrically connected to the PCB by an electrical flex.