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At IBM Research, optical solutions for intra-system optical interconnects
have been studied, evaluated and developed for several years [3-11].
Our activities aim to provide a generic technology platform for
a wide range of applications. Individual building blocks of such
a technology platform are illustrated in Figure 1. They range from
system and link architecture to CMOS I/O circuitry and optoelectronic
packages to the optical channel and optical interfaces. At the Zurich
Research Lab, a multidisciplinary effort covers many of these building
blocks.
The optics-related work of the I/O Link
Technology group is focused on
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system-level opportunities for optical links, |
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overall chip-to-chip link architecture, |
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CMOS driver and TIA designs with maximum speed
at minimal area and power consumption, and |
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the interface between the electrical and the
optical domain (opto-electronic packaging). |
The work of the Photonics
group is focused on the interface between the electrical and the
optical domain (opto-electronic
packaging), the development of integrated
optical polymer waveguides, and optical connectors. A passive
alignment concept was developed that enables low-cost assembly
of the optical and opto-electronic elements on the printed circuit
board.
Jointly, we realized a series of system-level demonstrators of
increasing complexity. One goal of these demonstrators has been
to gain practical experience with the integration of all the involved
building blocks to a complete optical interconnect system, and to
balance the numerous aspect of this multidisciplinary endeavor.
See the downloadable overview presentation for additional information.
Our efforts are performed in collaboration with various internal
and external partners such as the IBM Research Labs in the US and
in Japan, Varioprint
AG (printed circuit board technology), Intexys
Photonics (opto-electronic packages) and Rohm
& Haas (waveguide material).
References
| [1] |
D. A. B. Miller, "Rationale and challenges
for optical interconnects to electronic chips," Proceedings
of the IEEE, vol. 88, pp. 728-749, 2000. |
| [2] |
A. Benner, M. Ignatowski, J. Kash, D. Kuchta,
and M. Ritter, "Exploitation of optical interconnects in
future server architectures," IBM J. Res. & Dev., vol.
49, pp. 755-775, 2005. |
| [3] |
C. Berger, M. Kossel, C. Menolfi, T. Morf, T.
Toifl, and M. Schmatz, "High-density optical interconnects
within large-scale systems," Proc. SPIE, vol. 4942, pp.
222-235, 2003. PDF |
| [4] |
G.-L. Bona, B. Offrein, U. Bapst, C. Berger,
R. Beyeler, R. Budd, R. Dangel, L. Dellmann, and F. Horst, "Characterization
of parallel optical-interconnect waveguides integrated on a
printed circuit board," Proc. SPIE, vol. 5453, 2004. |
| [5] |
C. Berger, U. Bapst, G.-L. Bona, R. Dangel, L.
Dellmann, P. Dill, M. A. Kossel, T. Morf, B. Offrein, and M.
L. Schmatz, "Design and implementation of an optical interconnect
demonstrator with board-integrated waveguides and microlens
coupling," presented at Biophotonics/Optical Interconnects
and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS
Summer Topical Meetings, 2004. |
| [6] |
R. Dangel, U. Bapst, C. Berger, R. Beyeler, L.
Dellmann, F. Horst, B. Offrein, and G.-L. Bona, "Development
of a low-cost low-loss polymer waveguide technology for parallel
optical interconnect applications," presented at Biophotonics/Optical
Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest
of the LEOS Summer Topical Meetings, 2004. |
| [7] |
L. Dellmann, T. Lamprecht, S. Oggioni, M. Witzig,
R. Dangel, R. Beyeler, C. Berger, F. Horst, and B. Offrein,
"Butt-Coupled Optoelectronic Modules for High-Speed Optical
Interconnects," Proc. CLEO/Europe-EQEC 2005, Munich, 2005. |
| [8] |
C. Kromer, G. Sialm, C. Berger, T. Morf, M. L.
Schmatz, F. Ellinger, D. Erni, G.-L. Bona, and H. Jackel, "A
100-mW 4x10 Gb/s Transceiver in 80-nm CMOS for High-Density
Optical Interconnects," Solid-State Circuits, IEEE Journal
of, vol. 40, pp. 2667-2679, 2005. |
| [9] |
B. Offrein, C. Berger, R. Beyeler, R. Dangel,
L. Dellmann, F. Horst, T. Lamprecht, N. Meier, R. Budd, F. Libsch,
and J. Kash, "Parallel optical interconnects in printed
circuit boards," Proc. SPIE, vol. 5990, pp. 117-125, 2005. |
| [10] |
T. Morf, C. Menolfi, T. Toifl, C. Kromer, G.
Sialm, M. Kossel, J. Weiss, P. Buchmann, C. Berger, and M. Schmatz,
"Electrical and optical transceivers for short-range data
communication, fabricated in VLSI 90-nm bulk and SOI CMOS technology,"
presented at Compound Semiconductor Integrated Circuit Symposium,
2005. CSIC '05. IEEE, 2005. |
| [11] |
T. Lamprecht, F. Horst, R. Dangel, R. Beyeler,
N. Meier, L. Dellmann, M. Gmür, C. Berger, and B. Offrein,
"Passive Alignment of Optical Elements in a Printed Circuit
Board," presented at 56th Electronic Components and Technology
Conference (ECTC 2006), San Diego, 2006. |
| [12] |
C. Berger, L. Dellmann, P. Dill, F. Horst, B. Offrein, M.
Schmatz, S. Oggioni, M. Spreafico, G. Macario, "Integration
of Optical I/O with Organic Chip Packages",
in Photonics Packaging, Integration, and Interconnects VIII,
edited by A.L. Glebov, R.T. Chen, Proc. SPIE, Vol. 6899, 689912
(2008). Proceedings Photonics West 2008, San Jose, CA, January
2008. |
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IBM Research
English
times higher carrier frequency, thus avoiding many of the limitations
of electrical interconnects. The most important advantages and promises
of optics in this context are a higher bandwidth × length product,
higher density, plus potential cost and power savings for cases when
repeaters can be avoided. In consideration of the historical development
and of the projected future link performance, it can only be a question
of time until optics will also be used for "intra-box" data
communication.
