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The coupling of the light from the VCSELs into the waveguides and
from the waveguides onto the detectors is based on direct butt-coupling.
The silicon optoelectronic (OE) modules populated by flip-chip bonding
either with VCSELs or detectors are placed in direct contact with
the waveguides without additional optical elements. The light is
guided through the Si module by integrated waveguides based on holes
etched through the silicon, which are then oxidized and filled with
a polymer. This integrated OE module concept requires only one alignment
step in the board and is compatible with a multi-layer waveguides
approach.
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