The cutting-edge cleanrooms, which feature class 100/1000 facilities with class 10 mini-environments, accommodate the following processes:
- Lithography for pattern definition
- Wet processing for substrate cleaning and wet chemical etching
- Thin-film deposition on metals and isolators
- Dry etching for material removal using reactive gases
- Thermal processing for oxidation, annealing and vapor phase deposition
- Metrology/inspection with optical and electron microscopes for surface topology and thickness measurements
- Backend processes including plating, lapping/polishing, dicing and bonding
- Polymer waveguide processing for optical interconnects
Processes, most of which are semiconductor-based (silicon, III–V), are being conducted on materials similar to those used in standard semiconductor technology, such as silicon, metals, isolators, polymers, organics and oxides.
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Fact Sheet Nanotechnology Center [E | D]
Fact Sheet Noise-Free Labs [E | D]
