Together with the IEEE Circuits and Systems Society and the IEEE Electron Devices Society, IBM Research is hosting the 6th AI Compute Symposium at the IBM T.J. Watson Research Center THINKLab in Yorktown Heights, New York.

The IBM and IEEE sponsored Symposium will bring together dreamers, thinkers, and innovators in cutting-edge research for a one-day forum to explore AI Compute challenges and future research directions. The symposium provides both in-person and virtual attendance options, with in-person attendance being preferred. This symposium is free of charge.

The symposium will have eminent invited speakers, a student poster session, and a panel. Students are encouraged to submit poster abstracts. A best student poster will also be awarded. Please see the submission details below.


Join the live event here. See program times below.


Click here to register.


Live presentations from the IEEE AI Compute Symposium will be streamed on the day of the conference.

Registration will open at 8:00 am EST and the symposium starts at 8:40 am EST.
Coffee and pastries will be available during registration.


Information for in-person attendance






Poster track topics

T1: AI Chiplet and Emerging Hardware
T2: AI Algorithms
T3: AI Applications




Speaker photo

Rob Aitken, Distinguished Architect, Synopsys

Speaker photo

Huiming Bu, VP, IBM

Speaker photo

Arif Khan, Sr. Group Director, Cadence

Speaker photo

Dae-Woo Kim, Corporate VP, AVP, Samsung Electronics

Speaker photo

Tulika Mitra, Vice Provost and Chair Professor, National University of Singapore

Speaker photo

Samuel Naffziger, SVP and Corporate Fellow, AMD

Speaker photo

Debendra Das Sharma, Senior Fellow, Intel

Speaker photo

Andre Tost, Distinguished Engineer on Watsonx, IBM



Time Topic Speaker
8:00am Registration / Breakfast / Poster setup
8:40am Welcome & Security information Rajiv Joshi, Anna Topol, IBM
8:50am Keynote 1: Path to 1 Trillion Transistors in the Era of AI Huiming Bu, IBM
9:35am Keynote 2 (virtual): Next-Generation Accelerator Design: Specialize or Generalize? Tulika Mitra, NUS
10:10am Keynote 3: Technology and Architecture Requirements for Energy Efficient AI Sam Naffziger, AMD
10:55am Break / Poster Setup / CAS-EDS Announcement
11:10am Keynote 4 (virtual): 3D Package Solution, the new Boundary of Si and Package Technology Dae-Woo Kim, Samsung
11:45am Keynote 5: Impedance matching AI, EDA, Chips and Chiplets Rob Aitken, Synopsys
12:30pm - 1:15pm Lunch
1:15pm Poster Session / Tours
2:15pm Keynote 6: Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovation with Chiplets Debendra Das Sharma, Intel
3:00pm Keynote 7: The More-than-Moore Juggernaut for Differentiation and Disaggregation for Processors and SoCs in the Generative AI World Arif Khan, Cadence
3:45pm Break / CAS-EDS Announcement
4:00pm Keynote 8: Generative AI in the Enterprise World with watsonx Andre Tost, IBM
4:45pm Panel Discussion: AI’s Relentless Demands - Are Chiplets the Savior? Huiming Bu, Sam Naffziger, Rob Aitken, Debendra Das Sharma, Arif Khan, Andre Tost
5:45pm Closing Remarks & Best Poster Award Announcement Atome Watanabe, Rajiv Joshi, IBM
6:00pm Symposium concludes



The poster session will be an in-person format only. Poster abstracts (2 pages maximum) are invited that address advanced results in AI Compute topics. Please submit original work. Authors of accepted posters will be requested to produce a print-out of their poster and a poster presenter will be required to attend the symposium for the in-person poster session.

Posters submissions may be from academia and industry. A best poster contest will be held for student posters. Please note that only posters with student presenters are eligible for best poster awards. Please see the list of best poster winners from the 2023 symposium below.

Submission Process:

  • Please send poster abstracts as PDF attachments to the symposium email address:
  • Please use the IEEE 2-column template for abstract formatting.
  • Please including the following in the email submission:
    Email Subject: AICS23 Poster Submission
    Email Body: Poster Title, Authors & Affiliations, Is the poster presenter a student? (Y/N)

Abstract submission: 27 October 2023
Notification: 3 November 2023
Symposium: 28 November 2023


2023 Poster Session Winners


For a list of authors and poster titles, please click here.


Poster Track 1 - AI Chiplet & Emerging Hardware

  1. Jacob Vinod (UCLA)
    Efficient Compute-In-Memory in Non-Volatile Voltage-Controlled MRAM

Poster Track 2 - AI Algorithms

  1. Zishen Wan (Georgia Tech)
    Towards Bit Error Robust Energy-Efficient Autonomous Systems

Poster Track 3 - AI Applications

  1. Blair Lorson (Rensselaer Polytechnic Institute)
    Low-bit Quantization of Patch Time Series Transformer (PatchTST) Model



Advisory Committee

  • Kea-Tiong (Samuel) Tang (CAS)
  • Myung hoon Sunwoo (CAS)
  • Manuel Delgado-Restituto (CAS)
  • Ayan Datta

Poster Session Chairs

  • Xin Zhang
  • Krishnan Kailas
  • Atom Watanabe
  • Cheng Chi
  • Hadjer Benmeziane

General Chairs

  • Rajiv Joshi
  • Matthew M. Ziegler
  • Jin-Ping Han

Program Committee

  • Arvind Kumar
  • Kaoutar El Maghraoui
  • John Rozen
  • Krishnan Kailas
  • Xin Zhang
  • Anna Topol
  • Cheng Chi
  • Atom Watanabe
  • Hadjer Benmeziane

ThinkLab/Auditorium Event Head

  • Jenna Gray
  • George Tulevski


  • Bryan Dumas
  • John Noschese

IBM Web Support

  • Linda Rudin (Zurich, Switzerland)